IBM and 3M have come up with an adhesive that will allow them to stack up to 100 semiconductors onto a single microchip. Larry Greenemeier reports

據(jù)Larry Greenemeier報道，IBM和3M聯(lián)合研制了一種特殊的“膠水”，可以在一塊芯片上可以層疊100層半導(dǎo)元件。

Makers of the microchips found in smartphones, tablets and other gadgets are figuring out something that urban planners learned a long time ago—when you can no longer build out, you need to build up.

芯片制造商發(fā)現(xiàn)在智能手機、平板電腦以及其他電子設(shè)備迅速發(fā)展的今天，已經(jīng)沒有擴展空間給芯片升級了，而只能設(shè)法在有限的空間“向上”發(fā)展了，正如城市規(guī)劃者早已實施的那樣。

Stacked integrated circuits are today's tech skyscrapers. They're vital as consumer electronics makers look to cram more processing power and memory into smaller devices. But just like any other skyscraper, these 3-D chips have to keep the power flowing from layer to layer without overheating.

層疊式集成電路正是今天科技的摩天大樓。當電子設(shè)備制造商希望能更小的設(shè)備里實現(xiàn)更快的計算能力和更大的內(nèi)存時，層疊式集成電路的發(fā)展前景越來越有活力。但正如其他摩天大樓一樣，3-D芯片需要保證各層之間的能量保證，但又需避免發(fā)熱量過大。

IBM and 3M recently announced that they have a cool solution: a unique adhesive for packing the chip's layers. This adhesive can efficiently conduct heat through the densely packed layers of semiconductors inside these chips. This packaging should also keep heat away from sensitive components like logic circuits.

IBM和3M最近宣布他們發(fā)明了一種全新的解決方案，利用獨創(chuàng)的黏合劑將芯片層粘在一起。這種黏合劑可以有效的保證層疊式集成電路上的每一個結(jié)合緊密的半導(dǎo)體層之間能夠快速的傳導(dǎo)熱量，同時這種層疊技術(shù)可以保證如邏輯電路等敏感組件不至于過熱。

The companies say their new adhesive will be able to tightly stack up to 100 logic, networking and memory semiconductors into a single chip. Which could deliver processing speeds of up to one-thousand times faster than today—and turn your next iPhone from a four-story walk-up to a luxury high-rise.

兩家公司宣布，他們創(chuàng)新的黏合劑可以緊密的粘合100層邏輯、網(wǎng)絡(luò)以及內(nèi)存半導(dǎo)體部件在一塊芯片上，這將使芯片的運算速度提升1000倍，將來iPhone將從現(xiàn)在沒有電梯的四層小樓躍升為一座豪華的摩天大樓。
—Larry Greenemeier